Thermal decisions for AI-era hardware, made early.
DankaThermal gives hardware teams a faster path from concept to credible thermal insight for AI accelerators, chiplets, packages, PCBs, and full electronic assemblies.
Products & Services
Use the platform directly, or bring in Anemoi when dense compute programs are moving too fast.
Choose the platform for hands-on thermal analysis of compute-dense electronics, or work with Anemoi's engineering team when advanced packaging, cooling, and AI-hardware schedules leave little room for delay.
DankaThermal Cloud Platform
Browser-based thermal simulation for electronics teams building compute-dense systems that need to model, solve, compare variants, and share conclusions quickly.
- Chiplet, package, PCB, enclosure, and accelerator-system workflows
- Detailed power mapping with steady-state and transient analysis
- Shareable cloud results for design, package, and thermal teams
Imports, APIs, and Parametric Studies
Move faster from source data to decision-ready studies with model import paths, automation hooks, and workflows built for repeated architecture comparison.
- Geometry and design-data import options for electronics modeling
- API-driven studies for architecture trades, workload envelopes, and design-space exploration
- Optimization-ready runs for cooling and packaging decisions
Thermal Engineering Services
Bring in Anemoi when the thermal problem sits on the critical path for a dense-compute, advanced-packaging, or AI-hardware program.
- Custom model creation, calibration, and thermal bottleneck analysis
- Cooling strategy recommendations for packages, boards, and systems
- Project-specific support for advanced packaging and dense electronics
Enablement and Program Support
Get your team operational faster with guided onboarding, workflow setup, and expert review for programs where compute density and schedule pressure are both high.
- Onboarding for teams adopting thermal simulation in-house
- Best-practice workflows for repeatable model setup and review
- Hands-on support for customer demos, proposals, and internal milestones
Case studies
These examples show the kind of questions teams can answer quickly once the model is in place: which region runs hottest, which cooling move matters, and which package or architecture option is worth another turn.
QSFP-DD Module
Start from a dense double-sided assembly inside a cage and evaluate placement, via strategy, heat spreaders, and heat sink options before a local hot spot undermines signal integrity or module reliability.
GaN LED Array
Sweep power, pitch, substrate choice, and heat sink geometry to see how junction temperatures move across the array as power density climbs and thermal crowding begins.
Arduino for Industrial Applications
Start from a known board, adapt it to harsher operating conditions, and compare predicted temperatures against measured IR behavior before the design is pushed into a more compute-heavy deployment.
Chiplet Split
Use the API to screen partitioning, spacing, and stacking options for chiplet architectures so packaging teams can narrow high-bandwidth compute concepts before committing to expensive package iterations.
